TMC5161 DATASHEET (Rev. 1.01 / 2018-NOV-20)
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3- Inner Layer (supply VS)
4- Bottom Layer
Components
Figure 29.1 Layout example
Layout Hints
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Take care for good thermal power dissipation of all VM, OAx and OBx pads into the PCB.
Tune the power bridge layout for minimum loop inductivity. A compact layout is best.
Minimize the distance between the sense resistors and BRA/BRB terminals and connect the sense
resistors and the TMC5161 GND connections directly to the same GND plane using enough vias.
Add MOSFET bridge output capacitors (470pF - 1nF from each output to GND) to reduce ringing of
the outputs during switching events near the motor connector.
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