TMC5161 DATASHEET (Rev. 1.01 / 2018-NOV-20)
126
Parameter
total thickness
stand off
mold thickness
lead frame thickness
lead width
body size X
body size Y
lead pitch
Ref
A
A1
A2
A3
b
D
E
e
Min
Nom
Max
0.85
0.08
-
-
0.02
0.05
0.675
0.13
0.25
10.0
10.0
0.5
0.2
0.3
lead pitch
gap around exposed die e2
pads to neighbor pad
e1
0.559
0.3
exposed die pad size X
exposed die pad size X
exposed die pad size X
exposed die pad size X
exposed die pad size Y
exposed die pad size Y
exposed die pad size Y
lead length
lead length
lead length
package edge tolerance
mold flatness
coplanarity
J
J1
J2
J3
1.745
9.6
5.4
1.88
1.975
0.55
2.85
2.2
1.845
9.7
5.5
1.98
2.075
0.65
2.95
2.25
2.75
1.2
0.1
0.2
0.1
0.08
0.1
1.945
9.8
5.6
2.08
2.175
0.75
3.05
2.3
K
K1
K2
L
L1
L2
aaa
bbb
ccc
ddd
eee
2.7
1.15
2.8
1.25
lead offset
exposed pad offset
Attention
Due to the complex footprint, please use the footprint samples available from the TRINAMIC website
for different PCB software.
30.2 Package Codes
Type
Package
Temperature range
Code & marking
TMC5161-AA
AQFN-10x10 (RoHS)
-40°C ... +125°C
TMC5161-AA
www.trinamic.com
TRINAMIC [ TRINAMIC MOTION CONTROL GMBH & CO. KG. ]
