TMC5161 DATASHEET (Rev. 1.01 / 2018-NOV-20)
120
Parameter
Symbol Conditions
Typ
Unit
Typical overall power dissipation PD
stealthChop or spreadCycle, 30kHz
chopper, 24V, 2.8A RMS
2.7
W
stealthChop or spreadCycle, 30kHz
chopper, 24V, 3.5A RMS
4.3
W
Thermal resistance junction to
ambient on a multilayer board
for output MOSFET measured on
TMC6200-EVAL
RTJA
Single lowside MOSFET
50
40
K/W
K/W
Two lowside MOSFETs OA1 & OA2 or
OB1 & OB2
Single highside MOSFET
40
30
K/W
K/W
Dual signal, two internal power
plane board (2s2p) (FR4, 35µm
CU, 70mm x 133mm, d=1.5mm)
Two highside MOSFETs (OA1 & OA2 /
OB1 & OB2)
Table 28.1 Thermal characteristics
The thermal performance in an actual layout can be tested by checking for the heat up, using a
thermal camera. Heat distribution in stealthChop operation often is better and shows lower peak
values than with spreadCycle. Carefully check heat up under different conditions and select a suiting
overtemperature threshold, in case thermal protection is desired.
Figure 28.1 Thermal photo showing 3.5A RMS operation with spreadCycle on TMC6200-EVAL
Figure 28.2 Thermal distribution 3.5A RMS operation running stealthChop
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