TMC5161 DATASHEET (Rev. 1.01 / 2018-NOV-20)
119
Detector levels
Parameter
DC-Characteristics
Symbol Conditions
Min
Typ
Max Unit
VVSA undervoltage threshold for
RESET
VUV_VSA
VVSA rising
3.6
4
4.6
V
V5VOUT undervoltage threshold for VUV_5VOUT
RESET
VVCC_IO undervoltage threshold for VUV_VIO
RESET
V5VOUT rising
3.5
2.5
V
VVCC_IO rising (delay
typ. 10µs)
2.0
3.0
V
VVCC_IO undervoltage detector
hysteresis
VUV_VIOHYST
0.3
V
Overtemperature prewarning
120°C (control IC temperature)
Overtemperature shutdown
136 °C (control IC temperature)
Overtemperature shutdown
143 °C (control IC temperature)
Overtemperature shutdown
150 °C (control IC temperature)
tOTPW
Temperature rising
Temperature rising
Temperature rising
Temperature rising
100
120
136
143
150
140
°C
°C
°C
°C
tOT136
tOT143
tOT150
135
170
Sense resistor voltage levels
DC-Characteristics
fCLK=16MHz
Parameter
Symbol Conditions
Min
Typ
325
Max Unit
mV
Sense input peak threshold
voltage (low sensitivity)
(VSRxH-VSRxL)
VSRT
GLOBALSCALER=0
csactual=31
sin_x=248
Hyst.=0; IBRxy=0
Sense input tolerance / motor
current full scale tolerance
-using internal reference
ICOIL
GLOBALSCALER=0
-5
+5
%
Digital pins
DC-Characteristics
Parameter
Symbol Conditions
Min
-0.3
0.7 VVIO
Typ
Max Unit
Input voltage low level
Input voltage high level
Input Schmitt trigger hysteresis
VINLO
VINHI
VINHYST
0.3 VVIO
VVIO+0.3
V
V
V
0.12
VVIO
Output voltage low level
Output voltage high level
Input leakage current
Pullup / pull-down resistors
Digital pin capacitance
VOUTLO
VOUTHI
IILEAK
RPU/RPD
C
IOUTLO = 2mA
IOUTHI = -2mA
0.2
V
V
µA
kΩ
pF
VVIO-0.2
-10
132
10
200
166
3.5
28.3 Thermal Characteristics
The following table shall give an idea on the thermal resistance of the package. The thermal
resistance for a four-layer board will provide a good idea on a typical application. Actual thermal
characteristics will depend on the PCB layout, number and position of vias for heat transfer, PCB type
and PCB size. The thermal resistance will benefit from thicker CU (inner) layers for spreading heat
horizontally within the PCB. Also, air flow will reduce thermal resistance.
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