TMC5160 DATASHEET (Rev. 1.08 / 2018-NOV-19)
14
Pin
TQFP QFN
Type Function
Bridge Center and bootstrap capacitor negative connection.
BMA2
LA2
LA1
BMA1
HA1
CA1
CB2
HB2
BMB2
LB2
LB1
37
38
39
40
41
42
43
44
45
46
47
48
37
38
39
40
41
42
43
44
45
46
47
1
Low side gate driver output.
Low side gate driver output.
Bridge Center and bootstrap capacitor negative connection.
High side gate driver output.
Bootstrap capacitor positive connection.
Bootstrap capacitor positive connection.
High side gate driver output.
Bridge Center and bootstrap capacitor negative connection.
Low side gate driver output.
Low side gate driver output.
BMB1
Bridge Center and bootstrap capacitor negative connection.
Connect the exposed die pad to a GND plane. Provide as many
as possible vias for heat transfer to GND plane. Serves as GND
pin for the low side gate drivers. Ensure low loop inductivity
to sense resistor GND.
Exposed die
pad
-
-
*(pd) denominates a pin with pulldown resistor
* All digital pins DI, DIO and DO use VCC_IO level and contain protection diodes to GND and VCC_IO
* All digital inputs DI and DIO have internal Schmitt-Triggers
www.trinamic.com