48
TMC223 DATASHEET (V. 1.05 / March 7, 2011)
10 Package Thermal Resistance
10.1 SOIC-20 Package
The junction case thermal resistance is 28°C/W, leading to a junction ambient thermal resistance of
63°C/W, with the PCB ground plane layout condition given in the figure below and with
•
•
•
PCB thickness = 1.6mm
1 layer
Copper thickness = 35µm
×
×
(10mm 23mm)
2
Figure 27: Layout consideration
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