TMC223 DATASHEET (V. 1.05 / March 7, 2011)
47
9.2 QFN32
D
D1
32
1
Top view
J
C
17
24
Side view
16
25
EXPOSED DIE
ATTACH PAD
0°~12°
P
R 0.2
PIN1 I.D.
9
32
8
1
L
b
Bottom view
Figure 26: Package Outline QFN32
REF
MIN
A
A1
A2
A3
b
C
D
D1
E
E1
e
J
K
L
P
R
0.80
0.00 0.576
0.02 0.615 0.203
0.05 0.654
0.25
0.3
0.24
0.42
0.6
5.37
5.47
5.57
mm
5.37
5.47
5.57
mm
0.35
0.4
2.185
NOM
MAX
Unit
7
6.75
mm
7
6.75
mm
0.65
mm
45
0.90
mm
0.35
mm
0.45
mm
2.385
mm
mm
mm
mm
mm
mm
mm
deg.
Hint: The exposed die attached pad is electrical ground. This pad should be connected to ground or can be left open. It is
recommended to connect it to ground for cooling.
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