TSM931-TSM934
PACKAGE OUTLINE DRAWING
8-Pin MSOP Package Outline Drawing
(N.B., Drawings are not to scale)
3.10 Max
2.90 Min
0.38 Max
0.28 Min
0.65 REF
8
0.23 Max
0.13 Min
0.127
0.27 REF
3.10 Max
2.90 Min
5.08 Max
4.67 Min
GAUGE PLANE
0' -- 6'
1
2
0.70 Max
0.40 Min
0.25
0.38 Max
0.28 Min
DETAIL “A”
DETAIL ‘A’
0.95 Max
0.75 Min
SEATING PLANE
0.15 Max
0.05 Min
1.10 Max
0.10 Max
0.23 max
0.13 Min
NOTE:
1. PACKAGE LENGTH DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
2. PACKAGE WIDTH DOES NOT INCLUDE INTERLEAD FLASH OR PROTUSIONS.
3. CONTROLLING DIMENSION IN MILIMETERS.
4. THIS PART IS COMPLIANT WITH JEDEC MO-187 VARIATIONS AA
5. LEAD SPAN/STAND OFF HEIGHT/COPLANARITY ARE CONSIDERED AS SPECIAL CHARACTERISTIC.
TSM931_34DS r1p0
Page 19
RTFDS
TOUCHSTONE [ TOUCHSTONE SEMICONDUCTOR INC ]
