TPS767D3xx
SLVS209H – JULY 1999 – REVISED AUGUST 2008.........................................................................................................................................................
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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
AVAILABLE OPTIONS
(1)
DEVICE
TPS767D301
TPS767D318
TPS767D325
(1)
REGULATOR 1 V
OUT
(V)
Adjustable (1.5V – 5.5V)
1.8V
2.5V
REGULATOR 2 V
OUT
(V)
3.3V
3.3V
3.3V
For the most current specifications and package information see the Package Option Addendum at the end of this document, or see the
TI web site at
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating temperature range (unless otherwise noted).
TPS767D3xx
Input voltage range, V
1IN
, V
2IN (2)
Enable voltage range, V
1EN
, V
2EN
Output voltage range, V
1OUT
, V
2OUT
RESET voltage range, V
1RESET
, V
2RESET
Peak output current
ESD rating, HBM
Continuous total power dissipation
Operating junction temperature range, T
J
Storage temperature range, T
stg
(1)
(2)
2
See
table
–40 to +125
–65 to +150
°C
°C
–0.3 to +13.5
–0.3 to V
IN
+ 0.3
–0.3 to +7.0
–0.3 to +16.5
Internally limited
kV
UNIT
V
V
V
V
Stresses beyond those listed under
absolute maximum ratings
may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under
recommended operating
conditions
is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to network terminal ground.
POWER DISSIPATION RATINGS
PACKAGE
PWP
(1)
(1)
AIR FLOW
(CFM)
0
250
T
A
≤
+25°C
POWER RATING
3.58 W
5.07 W
DERATING FACTOR
ABOVE t
a
= +25°C
35.8 mW/°C
50.7 mW/°C
T
A
= +70°C
POWER RATING
1.97 W
2.79 W
T
A
= +85°C
POWER RATING
1.43 W
2.03 W
This parameter is measured with the recommended copper heat sink pattern on a 4-layer PCB, 1oz. copper on 4-in × 4-in ground layer.
For more information, refer to TI technical brief literature number
2
Copyright © 1999–2008, Texas Instruments Incorporated
TI [ TEXAS INSTRUMENTS ]
