TPS63000
TPS63001
TPS63002
www.ti.com
SLVS520–MARCH 2006
THERMAL INFORMATION
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added
heat sinks and convection surfaces, and the presence of other heat-generating components affect the
power-dissipation limits of a given component.
Three basic approaches for enhancing thermal performance are listed below.
•
•
•
Improving the power dissipation capability of the PCB design
Improving the thermal coupling of the component to the PCB
Introducing airflow in the system
The maximum recommended junction temperature (TJ) of the TPS6300x devices is 125 °C. The thermal
resistance of the 10-pin QFN 3 x 3 package (DRC) is RθJA = 48.7 °C/W, if the PowerPAD is soldered. Specified
regulator operation is assured to a maximum ambient temperature TA of 85 °C. Therefore, the maximum power
dissipation is about 820 mW. More power can be dissipated if the maximum ambient temperature of the
application is lower.
T
T
J(MAX)
R
A
125°C 85°C
48.7 °CńW
P
)
)
) 820 mW
D(MAX)
qJA
(8)
11
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