TPS56528
SLVSBV3A –APRIL 2013–REVISED APRIL 2013
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION(1)
TRANSPORT
TA
PACKAGE(2) (3)
ORDERABLE PART NUMBER
PIN
MEDIA
TPS56528DDA
Tube
–40°C to 85°C
DDA
8
TPS56528DDAR
Tape and Reel
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) All package options have Cu NIPDAU lead/ball finish.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
VALUE
UNIT
MIN
–0.3
–0.3
–0.3
–0.3
–0.3
–2
MAX
20
VIN, EN
VBST
26
VBST (10 ns transient)
VBST (vs SW)
VFB, PG
28
Input voltage range
Output voltage range
6.5
6.5
20
V
V
SW
SW (10 ns transient)
VREG5
–3
22
–0.3
–0.3
–0.2
6.5
0.3
0.2
2
GND
Voltage from GND to thermal pad, Vdiff
V
kV
V
Human Body Model (HBM)
Charged Device Model (CDM)
Electrostatic discharge
500
150
150
Operating junction temperature, TJ
Storage temperature, Tstg
–40
–55
°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
THERMAL INFORMATION
TPS56528
THERMAL METRIC(1)
UNITS
DDA (8 PINS)
θJA
Junction-to-ambient thermal resistance
44.4
51.6
27.8
8.7
θJCtop
θJB
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
ψJB
27.7
5.3
θJCbot
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
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