TPS23750
TPS23770
www.ti.com
SLVS590A–JULY 2005–REVISED AUGUST 2005
RECOMMENDED OPERATING CONDITIONS(1)(2)
All voltage values are with respect to VSS unless otherwise noted.
MIN
0
NOM
MAX UNIT
VDD
Input voltage range(3)
Input voltage range
COM, SEN, SENP
FB, COMP, MODE, BL
AUX to COM
RSP to RSN
AUX
67
VBIAS
16
V
0
0
V
0
1
0
2
Sourcing current
VBIAS
0
2
mA
COMP
0
2
QG
GATE loading
20
nC
µF
µF
kΩ
°C
°C
AUX load capacitance
VBIAS load capacitance
RFREQ
0.8
0.08
30
25
1.5
300
125
85
TJ
Operating junction temperature range
Operating ambient temperature range
-40
-40
TA
(1) RSN, COM, and RTN should be tied together. SENP should be tied to VDD except for the buck configuration, where it should be tied to
the output positive rail.
(2) TMR, FREQ, CLASS, DET, VBIAS, and GATE should not be externally driven.
(3) Junction temperature may be a constraining factor for high bias power designs.
DISSIPATION RATINGS TABLE
θJP
θJC
°C/W
θJA
θJA
θJA
MAXIMUM POWER RATING
(W)(5)
PACKAGE
°C/W(1)
°C/W(2)
°C/W(3)
°C/W(4)
PWP (TSSOP-20)
1.4
26.62
32.6
151.9
73.8
1.2
(1) Thermal resistance junction to pad.
(2) See TI document SLMA002 for recommended layout. This is a best case, zero airflow number.
(3) JEDEC method with low-k board (2 signal layers) and power pad not soldered (worst case).
(4) JEDEC method with high-k board (4 layers, 2 signal and 2 planes) and power pad not soldered.
(5) Based on TI recommended layout and 85°C ambient.
3
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