TPS1H100-Q1
ZHCSDD8D –OCTOBER 2014–REVISED DECEMBER 2019
www.ti.com.cn
Layout Example (continued)
10.2.2 With a GND Network
With a GND network, tie the thermal pad with a single trace through the GND network to the board GND copper.
GND Network
14
NC
ST/CS
CL
1
2
3
4
5
6
7
13
GND
IN
DIAG_EN
12
11
Thermal
Pad
NC
NC
VS
VS
VS
10
OUT
OUT
OUT
9
8
Figure 51. Layout With a GND Network
10.3 Thermal Considerations
This device possesses thermal shutdown (TSD) circuitry as a protection from overheating. For continuous normal
operation, the junction temperature should not exceed the thermal-shutdown trip point. If the junction temperature
exceeds the thermal-shutdown trip point, the output turns off. When the junction temperature falls below the
thermal-shutdown trip point, the output turns on again.
Calculate the power dissipated by the device according to Equation 13.
PT = IOUT2 ì RDSON + VS ìInom
where
•
PT = Total power dissipation of the device
(13)
After determining the power dissipated by the device, calculate the junction temperature from the ambient
temperature and the device thermal impedance.
TJ = TA + RqJA ìPT
(14)
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