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TPA3004D2 参数 Datasheet PDF下载

TPA3004D2图片预览
型号: TPA3004D2
PDF下载: 下载PDF文件 查看货源
内容描述: 12 -W立体声D类音频功率放大器采用直流音量控制放大器 [12-W STEREO CLASS-D AUDIO POWER AMPLIFIER WITH DC VOLUME CONTROL]
分类和应用: 放大器功率放大器
文件页数/大小: 43 页 / 736 K
品牌: TI [ TEXAS INSTRUMENTS ]
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www.ti.com  
TERMINAL  
ꢀ ꢁꢂ ꢃꢄꢄ ꢅꢆ ꢇ  
SLOS407D − FEBRUARY 2003 − REVISED AUGUST 2004  
Terminal Functions (Continued)  
I/O  
DESCRIPTION  
NO.  
VAROUTR  
VCLAMPL  
VCLAMPR  
VOLUME  
VREF  
NAME  
32  
25  
36  
11  
8
O
I
Variable output for right channel audio. Line level output for driving external HP amplifier.  
Internally generated voltage supply for left channel bootstrap capacitors.  
Internally generated voltage supply for right channel bootstrap capacitors.  
DC voltage that sets the gain of the Class-D and VAROUT outputs.  
I
Analog reference for gain control section.  
V2P5  
4
O
2.5-V Reference for analog cells, as well as reference for unused audio input when using single-ended inputs.  
Connect to AGND and PGND—should be center point for both grounds.  
Thermal  
Pad  
ABSOLUTE MAXIMUM RATINGS  
over operating free-air temperature range unless otherwise noted  
(1)  
UNIT  
−0.3 V to 20 V  
3.6 Ω  
Supply voltage range: AV  
CC,  
PV  
CC  
Load impedance, R  
L
MODE, VREF, VARDIFF, VARMAX, VOLUME, FADE  
0 V to 5.5 V  
SD  
−0.3 V to V  
+ 0.3 V  
Input voltage range, V  
CC  
I
RINN, RINP, LINN, LINP  
−0.3 V to 7 V  
AV  
DD  
120 mA  
10 mA  
Supply current  
Output current  
AVDDREF  
VAROUTL, VAROUTR  
20 mA  
Continuous total power dissipation  
Operating free-air temperature range, T  
See Dissipation Rating Table  
−40°C to 85°C  
−40°C to 150°C  
−65°C to 150°C  
260°C  
A
(2)  
Operating junction temperature range, T  
J
Storage temperature range, T  
stg  
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds  
(1)  
(2)  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
The TPA3004D2 incorporates an exposed PowerPAD on the underside of the chip. This acts as a heatsink and must be connected to a thermally  
dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature that could permanently  
damage the device. See TI Technical Brief SLMA002 for more information about utilizing the PowerPAD thermally enhanced package.  
PACKAGE DISSIPATION RATINGS  
PACKAGE  
T
A
25°C  
DERATING FACTOR  
T
A
= 70°C  
T = 85°C  
A
(1)  
PHP  
4.3 W  
34.7 mW/°C  
2.7 W  
2.2 W  
(1)  
The PowerPAD must be soldered to a thermal land on the printed circuit board. Please refer to the PowerPAD  
Thermally Enhanced Package application note (SLMA002  
5
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