TMS320VC5416
Fixed-Point Digital Signal Processor
www.ti.com
SPRS095O–MARCH 1999–REVISED JANUARY 2005
6
Mechanical Data
The following mechanical package diagram(s) reflect the most current released mechanical data available
for the designated device(s).
6.1 Package Thermal Resistance Characteristics
Table 6-1provides the estimated thermal resistance characteristics for the recommended package types
used on the device.
Table 6-1. Thermal Resistance Characteristics
PARAMETER
RθJA
GGU PACKAGE
PGE PACKAGE
UNIT
°C/W
°C/W
38
5
56
5
RθJC
Mechanical Data
93