T M S3 2 0 VC5 402
F I X ED ĆPOI N T DI G I TAL S I GN AL PRO CE SSO R
SPRS079E – OCTOBER 1998 – REVISED AUGUST 2000
MECHANICAL DATA
GGU (S-PBGA-N144)
PLASTIC BALL GRID ARRAY PACKAGE
12,10
SQ
9,60 TYP
0,80
11,90
N
M
L
K
J
H
G
F
E
D
C
B
A
1
2 3 4 5 6 7 8 9 10 11 12 13
0,95
0,85
1,40 MAX
Seating Plane
0,10
0,55
0,45
0,12
0,08
M
0,08
0,45
0,35
4073221-2/B 08/00
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. MicroStar BGA configuration
Thermal Resistance Characteristics
PARAMETER
°C/W
R
38
ΘJA
ΘJC
R
5
66
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TI [ TEXAS INSTRUMENTS ]
