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TMS320F28232 参数 Datasheet PDF下载

TMS320F28232图片预览
型号: TMS320F28232
PDF下载: 下载PDF文件 查看货源
内容描述: 数字信号控制器(DSC ) [Digital Signal Controllers (DSCs)]
分类和应用: 控制器
文件页数/大小: 170 页 / 2247 K
品牌: TI [ TEXAS INSTRUMENTS ]
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TMS320F28335, TMS320F28334, TMS320F28332  
TMS320F28235, TMS320F28234, TMS320F28232  
Digital Signal Controllers (DSCs)  
www.ti.com  
SPRS439CJUNE 2007REVISED FEBRUARY 2008  
6.10.7.8 External Interface Ready-on-Write Timing With One External Wait State  
Table 6-45. External Interface Write Switching Characteristics (Ready-on-Write, 1 Wait State)  
PARAMETER  
MIN  
MAX  
UNIT  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
td(XCOH-XZCSL)  
td(XCOHL-XZCSH)  
td(XCOH-XA)  
Delay time, XCLKOUT high to zone chip-select active low  
Delay time, XCLKOUT high or low to zone chip-select inactive high  
Delay time, XCLKOUT high to address valid  
Delay time, XCLKOUT high/low to XWE0, XWE1 low(1)  
Delay time, XCLKOUT high/low to XWE0, XWE1 high(1)  
Delay time, XCLKOUT high to XR/W low  
1
3
2
2
2
1
1
– 2  
td(XCOHL-XWEL)  
td(XCOHL-XWEH)  
td(XCOH-XRNWL)  
td(XCOHL-XRNWH)  
ten(XD)XWEL  
Delay time, XCLKOUT high/low to XR/W high  
– 2  
0
Enable time, data bus driven from XWE0, XWE1 low(1)  
Delay time, data valid after XWE0, XWE1 active low(1)  
Hold time, address valid after zone chip-select inactive high  
Hold time, write data valid after XWE0, XWE1 inactive high(1)  
Maximum time for DSP to release the data bus after XR/W inactive high  
td(XWEL-XD)  
4
(2)  
th(XA)XZCSH  
th(XD)XWE  
TW-2(3)  
tdis(XD)XRNW  
4
(1) XWE1 is used in 32-bit data bus mode only. In 16-bit, this signal is XA0.  
(2) During inactive cycles, the XINTF address bus always holds the last address put out on the bus. This includes alignment cycles.  
(3) TW = trail period, write access (see Table 6-36)  
Table 6-46. Synchronous XREADY Timing Requirements (Ready-on-Write, 1 Wait State)(1)  
MIN  
15  
MAX  
UNIT  
ns  
tsu(XRDYsynchL)XCOHL  
th(XRDYsynchL)  
Setup time, XREADY (synchronous) low before XCLKOUT high/low  
Hold time, XREADY (synchronous) low  
12  
ns  
te(XRDYsynchH)  
Earliest time XREADY (synchronous) can go high before the sampling  
XCLKOUT edge  
3
ns  
tsu(XRDYsynchH)XCOHL  
th(XRDYsynchH)XZCSH  
Setup time, XREADY (synchronous) high before XCLKOUT high/low  
Hold time, XREADY (synchronous) held high after zone chip select high  
15  
0
ns  
ns  
(1) The first XREADY (synchronous) sample occurs with respect to E in Figure 6-27:  
E =(XWRLEAD + XWRACTIVE) tc(XTIM)  
When first sampled, if XREADY (synchronous) is high, then the access will complete. If XREADY (synchronous) is low, it is sampled  
again each tc(XTIM) until it is high.  
For each sample, setup time from the beginning of the access can be calculated as:  
F = (XWRLEAD + XWRACTIVE +n –1) tc(XTIM) – tsu(XRDYsynchL)XCOHL  
where n is the sample number: n = 1, 2, 3, and so forth.  
Table 6-47. Asynchronous XREADY Timing Requirements (Ready-on-Write, 1 Wait State)(1)  
MIN  
11  
8
MAX UNIT  
tsu(XRDYasynchL)XCOHL  
th(XRDYasynchL)  
Setup time, XREADY (asynchronous) low before XCLKOUT high/low  
Hold time, XREADY (asynchronous) low  
ns  
ns  
te(XRDYasynchH)  
Earliest time XREADY (asynchronous) can go high before the sampling  
XCLKOUT edge  
3
ns  
tsu(XRDYasynchH)XCOHL  
th(XRDYasynchH)XZCSH  
Setup time, XREADY (asynchronous) high before XCLKOUT high/low  
Hold time, XREADY (asynchronous) held high after zone chip select high  
11  
0
ns  
ns  
(1) The first XREADY (synchronous) sample occurs with respect to E in Figure 6-27:  
E = (XWRLEAD + XWRACTIVE –2) tc(XTIM). When first sampled, if XREADY (asynchronous) is high, then the access will complete. If  
XREADY (asynchronous) is low, it is sampled again each tc(XTIM) until it is high.  
For each sample, setup time from the beginning of the access can be calculated as:  
F = (XWRLEAD + XWRACTIVE –3 + n) tc(XTIM) – tsu(XRDYasynchL)XCOHL  
where n is the sample number: n = 1, 2, 3, and so forth.  
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Electrical Specifications  
147