ꢀ ꢁ ꢂ ꢃ ꢄꢅ ꢆ ꢇ ꢈꢉ ꢈꢀꢊ ꢀꢁ ꢂꢃ ꢄ ꢅ ꢆꢇ ꢈ ꢉ ꢋꢀꢊ ꢀꢁ ꢂꢃ ꢄ ꢅ ꢆꢇ ꢈ ꢉ ꢇ ꢀ
ꢌ ꢍ ꢎꢏ ꢐꢑꢒ ꢓꢍ ꢔ ꢀ ꢐꢍ ꢕ ꢍ ꢀꢖꢗ ꢂ ꢍ ꢕꢔ ꢖꢗ ꢒ ꢘꢓ ꢆꢏ ꢂꢂꢓ ꢘꢂ
SPRS226H − NOVEMBER 2003 − REVISED AUGUST 2005
device and development-support tool nomenclature (continued)
( )
TMS 320
C
6415T GLZ
7
PREFIX
DEVICE SPEED RANGE
6 (600-MHz CPU, 133-MHz EMIFA)
7 (720-MHz CPU, 133-MHz EMIFA)
8 (850-MHz CPU, 133 MHz EMIFA)
1 (1-GHz CPU, 133-MHz EMIFA)
TMX= Experimental device
TMP= Prototype device
TMS= Qualified device
SMX= Experimental device, MIL
SMJ = MIL-PRF-38535, QML
SM = High Rel (non-38535)
†‡
TEMPERATURE RANGE (DEFAULT: 0°C TO 90°C)
Blank = 0°C to 90°C, commercial temperature
A
= −40°C to 105°C, extended temperature
DEVICE FAMILY
3 or 32 or 320
=
TMS320ꢃ DSP family
§#
PACKAGE TYPE
GLZ = 532-pin plastic BGA
ZLZ = 532-pin plastic BGA, with Pb−free soldered balls
TECHNOLOGY
C = CMOS
¶
DEVICE
C64x DSP:
6414T
6415T
6416T
†
‡
§
¶
#
The extended temperature “A version” devices may have different operating conditions than the commercial temperature devices.
See the Recommended Operating Conditions section of this data sheet for more details.
BGA= Ball Grid Array
For the actual device part numbers (P/Ns) and ordering information, see the TI website (www.ti.com).
The ZLZ mechanical package designator represents the version of the GLZ with Pb−Free soldered balls.
Figure 5. TMS320C64x DSP Device Nomenclature (Including the C6414T, C6415T, and C6416T Devices)
For additional information, see the TMS320C6414T, TMS320C6415T, and TMS320C6416T Digital Signal
Processors Silicon Errata (literature number SPRZ216)
64
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