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TMS320F2809 参数 Datasheet PDF下载

TMS320F2809图片预览
型号: TMS320F2809
PDF下载: 下载PDF文件 查看货源
内容描述: - 12号的铝制车身绘( RAL 7032 ) []
分类和应用:
文件页数/大小: 134 页 / 1127 K
品牌: TI [ TEXAS INSTRUMENTS ]
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TMS320F2809, TMS320F2808, TMS320F2806  
TMS320F2802, TMS320F2801, UCD9501  
TMS320C2802, TMS320C2801, and TMS320F2801x DSPs  
www.ti.com  
SPRS230HOCTOBER 2003REVISED JUNE 2006  
2.2 Signal Descriptions  
Table 2-3 describes the signals on the 280x devices. All digital inputs are TTL-compatible. All outputs are  
3.3 V with CMOS levels. Inputs are not 5-V tolerant.  
Table 2-3. Signal Descriptions  
PIN NO.  
GGM/  
ZGM  
BALL #  
(1)  
NAME  
DESCRIPTION  
PZ  
PIN #  
JTAG  
JTAG test reset with internal pulldown. TRST, when driven high, gives the scan system control of  
the operations of the device. If this signal is not connected or driven low, the device operates in its  
functional mode, and the test reset signals are ignored.  
NOTE: Do not use pullup resistors on TRST; it has an internal pull-down device. TRST is an active  
high test pin and must be maintained low at all times during normal device operation. In a low-noise  
environment, TRST may be left floating. In other instances, an external pulldown resistor is highly  
recommended. The value of this resistor should be based on drive strength of the debugger pods  
applicable to the design. A 2.2-kresistor generally offers adequate protection. Since this is  
application-specific, it is recommended that each target board be validated for proper operation of  
the debugger and the application. (I, )  
TRST  
84  
A6  
TCK  
TMS  
75  
74  
A10  
B10  
JTAG test clock with internal pullup (I, )  
JTAG test-mode select (TMS) with internal pullup. This serial control input is clocked into the TAP  
controller on the rising edge of TCK. (I, )  
JTAG test data input (TDI) with internal pullup. TDI is clocked into the selected register (instruction  
or data) on a rising edge of TCK. (I, )  
TDI  
73  
76  
C9  
B9  
JTAG scan out, test data output (TDO). The contents of the selected register (instruction or data)  
are shifted out of TDO on the falling edge of TCK. (O/Z 8 mA drive)  
TDO  
Emulator pin 0. When TRST is driven high, this pin is used as an interrupt to or from the emulator  
system and is defined as input/output through the JTAG scan. This pin is also used to put the  
device into boundary-scan mode. With the EMU0 pin at a logic-high state and the EMU1 pin at a  
logic-low state, a rising edge on the TRST pin would latch the device into boundary-scan mode.  
(I/O/Z, 8 mA drive )  
EMU0  
80  
A8  
NOTE: An external pullup resistor is recommended on this pin. The value of this resistor should be  
based on the drive strength of the debugger pods applicable to the design. A 2.2-kto 4.7-kΩ  
resistor is generally adequate. Since this is application-specific, it is recommended that each target  
board be validated for proper operation of the debugger and the application.  
Emulator pin 1. When TRST is driven high, this pin is used as an interrupt to or from the emulator  
system and is defined as input/output through the JTAG scan. This pin is also used to put the  
device into boundary-scan mode. With the EMU0 pin at a logic-high state and the EMU1 pin at a  
logic-low state, a rising edge on the TRST pin would latch the device into boundary-scan mode.  
(I/O/Z, 8 mA drive )  
NOTE: An external pullup resistor is recommended on this pin. The value of this resistor should be  
based on the drive strength of the debugger pods applicable to the design. A 2.2-kto 4.7-kΩ  
resistor is generally adequate. Since this is application-specific, it is recommended that each target  
board be validated for proper operation of the debugger and the application.  
EMU1  
81  
96  
B7  
C4  
FLASH  
3.3-V Flash Core Power Pin. This pin should be connected to 3.3 V at all times. On the ROM  
VDD3VFL  
parts (C280x), this pin should be connected to VDDIO  
.
TEST1  
TEST2  
97  
98  
A3  
B3  
Test Pin. Reserved for TI. Must be left unconnected. (I/O)  
Test Pin. Reserved for TI. Must be left unconnected. (I/O)  
CLOCK  
Output clock derived from SYSCLKOUT. XCLKOUT is either the same frequency, one-half the  
frequency, or one-fourth the frequency of SYSCLKOUT. This is controlled by the bits 1, 0  
(XCLKOUTDIV) in the XCLK register. At reset, XCLKOUT = SYSCLKOUT/4. The XCLKOUT signal  
can be turned off by setting XCLKOUTDIV to 3. Unlike other GPIO pins, the XCLKOUT pin is not  
placed in high-impedance state during a reset. (O/Z, 8 mA drive).  
XCLKOUT  
XCLKIN  
66  
90  
E8  
B5  
External Oscillator Input. This pin is to feed a clock from an external 3.3-V oscillator. In this case,  
the X1 pin must be tied to GND. If a crystal/resonator is used (or if an external 1.8-V oscillator is  
used to feed clock to X1 pin), this pin must be tied to GND. (I)  
(1) I = Input, O = Output, Z = High impedance, OD = Open drain, = Pullup, = Pulldown  
Introduction  
19  
 
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