TMS320F2809, TMS320F2808, TMS320F2806
TMS320F2802, TMS320F2801, UCD9501
TMS320C2802, TMS320C2801, and TMS320F2801x DSPs
www.ti.com
SPRS230H–OCTOBER 2003–REVISED JUNE 2006
8
Mechanical Data
Table 8-1, Table 8-2, Table 8-3, and Table 8-4 show the thermal data.
The mechanical package diagram(s) that follow the tables reflect the most current released mechanical
data available for the designated device(s).
Table 8-1. F280x, UCD9501 Thermal Model 100-pin GGM Results
AIR FLOW
PARAMETER
0 lfm
30.58
0.4184
12.08
16.46
150 lfm
29.31
0.32
250 lfm
28.09
500 lfm
26.62
θJA[°C/W] High k PCB
ΨJT[°C/W]
θJC
0.3725
0.4887
θJB
Table 8-2. F280x, UCD9501 Thermal Model 100-pin PZ Results
AIR FLOW
PARAMETER
0 lfm
48.16
0.3425
12.89
29.58
150 lfm
40.06
0.85
250 lfm
37.96
500 lfm
35.17
θJA[°C/W] High k PCB
ΨJT[°C/W]
θJC
1.0575
1.410
θJB
Table 8-3. C280x Thermal Model 100-pin GGM Results
AIR FLOW
PARAMETER
0 lfm
36.33
0.57
150 lfm
35.01
0.43
250 lfm
33.81
0.52
500 lfm
32.31
0.67
θJA[°C/W] High k PCB
ΨJT[°C/W]
θJC
14.18
21.36
θJB
Table 8-4. C280x Thermal Model 100-pin PZ Results
AIR FLOW
PARAMETER
0 lfm
69.81
0.42
150 lfm
60.34
1.23
250 lfm
57.46
1.54
500 lfm
53.63
2.11
θJA[°C/W] High k PCB
ΨJT[°C/W]
θJC
13.52
54.78
θJB
Mechanical Data
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