TLV3501-Q1
SBOS533A –SEPTEMBER 2010–REVISED SEPTEMBER 2010
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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
PRODUCT
PACKAGE-LEAD
PACKAGE DESIGNATOR(2)
PACKAGE MARKING
TLV3501AQDBVRQ1
SOT23-6
DBV
VCBQ
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the
device product folder at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
ABSOLUTE MAXIMUM RATINGS(1)
Over operating free-air temperature range (unless otherwise noted).
TLV3501-Q1
UNIT
V
Supply voltage
5.5
Signal input terminal voltage(2)
Signal input terminal current(2)
Output short-circuit current(3)
Thermal impedance, junction to free air
Operating temperature
(V−) − 0.3 to (V+) + 0.3
V
10
74
mA
mA
°C/W
°C
200
−40 to +125
−65 to +150
150
Storage temperature
°C
Junction temperature
°C
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not supported.
(2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.3V beyond the supply rails should
be current limited to 10mA or less.
(3) Short circuit to ground, one comparator per package
2
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Product Folder Link(s): TLV3501-Q1
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