TLC5970
www.ti.com
SBVS140 –MARCH 2010
PIN CONFIGURATIONS
DAP PACKAGE
HTSSOP-32 PowerPAD
(TOP VIEW)
RHP PACKAGE
QFN-28
(TOP VIEW)
32
VCC
GND
1
2
3
4
5
6
7
31 NC
30 PH
SWOFF
VREG
29 BOOT
28 NC
VREGIF
1
2
3
4
5
6
7
21 BOOT
20 FB
VREGIF
IREF2
IREF1
IREF0
VROM
SDTA
NC(1)
IREF2
IREF1
IREF0
NC
27
26
FB
19 OUT2
18 OUT1
17 OUT0
16 SDTY
15 SDTZ
Thermal Pad
(Bottom Side)
NC
8
25 OUT2
24 OUT1
23 OUT0
22 NC
Thermal Pad
(Bottom Side)
9
VROM 10
NC 11
SDTB
SDTA 12
21 SDTY
20 SDTZ
19 NC
SDTB
NC
13
14
15
16
(1) NC = not connected
SCKA
SCKB
18 SCKY
17 SCKZ
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11
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