PACKAGE OPTION ADDENDUM
www.ti.com
30-Apr-2011
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
5962-9755001QXA
TL16C552AFN
ACTIVE
ACTIVE
CFP
HV
FN
68
68
1
TBD
Call TI
N / A for Pkg Type
PLCC
18
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
TL16C552AFNG4
TL16C552AFNR
TL16C552AFNRG4
TL16C552AIFN
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PLCC
PLCC
PLCC
PLCC
PLCC
FN
FN
FN
FN
FN
68
68
68
68
68
18
250
250
18
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
TL16C552AIFNG4
18
Green (RoHS
& no Sb/Br)
TL16C552AIFNR
TL16C552AMHV
TL16C552AMHVB
TL16C552APN
OBSOLETE
ACTIVE
PLCC
CFP
FN
HV
HV
PN
68
68
68
80
TBD
TBD
TBD
Call TI
Call TI
Call TI
Call TI
1
1
N / A for Pkg Type
N / A for Pkg Type
ACTIVE
CFP
ACTIVE
LQFP
119
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
TL16C552APNG4
ACTIVE
LQFP
PN
80
119
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Addendum-Page 1
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