SCES296W – FEBRUARY 2000 – REVISED JUNE 2008
..................................................................................................................................................
www.ti.com
DESCRIPTION/ORDERING INFORMATION
This single buffer/driver is designed for 1.65-V to 5.5-V V
CC
operation.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
The output of the SN74LVC1G07 device is open drain and can be connected to other open-drain outputs to
implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.
This device is fully specified for partial-power-down applications using I
off
.The I
off
circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
T
A
PACKAGE
(1) (2)
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZV (Pb-free)
–40＝C to
85＝C
SON – DRY
SOT (SOT-23) – DBV
SOT (SC-70) – DCK
SOT (SOT-553) – DRL
(1)
(2)
(3)
Reel of 3000
Reel of 3000
Reel of 5000
Reel of 3000
Reel of 250
Reel of 3000
Reel of 250
Reel of 4000
ORDERABLE
PART NUMBER
SN74LVC1G07YZPR
SN74LVC1G07YZVR
SN74LVC1G07DRYR
SN74LVC1G07DRYRG4
SN74LVC1G07DBVR
SN74LVC1G07DBVT
SN74LVC1G07DCKR
SN74LVC1G07DCKT
SN74LVC1G07DRLR
TOP-SIDE
MARKING
(3)
_ _ _CV_
____
CV
CV_
C07_
CV_
CV_
Package drawings, thermal data, and symbolization are available at
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at
DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
YZV: The actual top-side marking is on two lines. Line 1 has four characters to denote year, month, day, and assembly/test site. Line 2
has two characters which show the family and function code. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
2
Product Folder Link(s):
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