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SCES296W – FEBRUARY 2000 – REVISED JUNE 2008
SINGLE BUFFER/DRIVER WITH OPEN-DRAIN OUTPUT
1
FEATURES
•
•
•
I
off
Supports Partial-Power-Down Mode
Operation
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DRL PACKAGE
(TOP VIEW)
•
Available in the Texas Instruments
NanoFree™ Package
•
Supports 5-V V
CC
Operation
•
Input and Open-Drain Output Accept
Voltages up to 5.5 V
•
Max t
pd
of 4.2 ns at 3.3 V
•
Low Power Consumption, 10-µA Max I
CC
•
±24-mA Output Drive at 3.3 V
2
DBV PACKAGE
(TOP VIEW)
DCK PACKAGE
(TOP VIEW)
N.C.
A
GND
1
5
V
CC
N.C.
A
1
2
3
5
V
CC
N.C.
A
GND
1
2
3
5
V
CC
Y
2
4
GND
4
4
Y
3
Y
DRY PACKAGE
(TOP VIEW)
N.C.
A
1
2
3
6
V
CC
N.C.
Y
5
4
GND
N.C. – No internal connection
See mechanical drawings for dimensions.
YZP PACKAGE
(TOP VIEW)
YZP PACKAGE TERMINAL ASSIGNMENTS
1
A
B
C
DNU
A
GND
2
V
CC
No ball
Y
DNU
A
GND
A1
A2
V
CC
Y
B1
B2
C1
C2
DNU – Do not use
YZV PACKAGE
(TOP VIEW)
YZV PACKAGE TERMINAL ASSIGNMENTS
1
2
V
CC
Y
A
B
A
GND
A
GND
A1
A2
V
CC
Y
B1
B2
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
Copyright © 2000–2008, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TI [ TEXAS INSTRUMENTS ]
