PACKAGE OPTION ADDENDUM
www.ti.com
8-Dec-2008
PACKAGING INFORMATION
Orderable Device
SN74LVC1G07DBVR
SN74LVC1G07DBVRE4
SN74LVC1G07DBVRG4
SN74LVC1G07DBVT
SN74LVC1G07DBVTE4
SN74LVC1G07DBVTG4
SN74LVC1G07DCKR
SN74LVC1G07DCKRE4
SN74LVC1G07DCKRG4
SN74LVC1G07DCKT
SN74LVC1G07DCKTE4
SN74LVC1G07DCKTG4
SN74LVC1G07DRLR
SN74LVC1G07DRLRG4
SN74LVC1G07DRYR
SN74LVC1G07DRYRG4
SN74LVC1G07YZPR
SN74LVC1G07YZVR
(1)
Status
(1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package
Type
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SC70
SC70
SC70
SC70
SC70
SC70
SOT
SOT
SON
SON
DSBGA
DSBGA
Package
Drawing
DBV
DBV
DBV
DBV
DBV
DBV
DCK
DCK
DCK
DCK
DCK
DCK
DRL
DRL
DRY
DRY
YZP
YZV
Pins Package Eco Plan
(2)
Qty
5
5
5
5
5
5
5
5
5
5
5
5
5
5
6
6
5
4
3000 Green (RoHS &
no Sb/Br)
3000 Green (RoHS &
no Sb/Br)
3000 Green (RoHS &
no Sb/Br)
250
250
250
Green (RoHS &
no Sb/Br)
Green (RoHS &
no Sb/Br)
Green (RoHS &
no Sb/Br)
Lead/Ball Finish
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
SNAGCU
SNAGCU
MSL Peak Temp
(3)
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
3000 Green (RoHS &
no Sb/Br)
3000 Green (RoHS &
no Sb/Br)
3000 Green (RoHS &
no Sb/Br)
250
250
250
Green (RoHS &
no Sb/Br)
Green (RoHS &
no Sb/Br)
Green (RoHS &
no Sb/Br)
4000 Green (RoHS &
no Sb/Br)
4000 Green (RoHS &
no Sb/Br)
5000 Green (RoHS &
no Sb/Br)
5000 Green (RoHS &
no Sb/Br)
3000 Green (RoHS &
no Sb/Br)
3000 Green (RoHS &
no Sb/Br)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
for the latest availability information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
Addendum-Page 1
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