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RM46L450PGET 参数 Datasheet PDF下载

RM46L450PGET图片预览
型号: RM46L450PGET
PDF下载: 下载PDF文件 查看货源
内容描述: RM46Lx50 16位/ 32位RISC闪存微控制器 [RM46Lx50 16/32-Bit RISC Flash Microcontroller]
分类和应用: 闪存微控制器
文件页数/大小: 172 页 / 2534 K
品牌: TI [ TEXAS INSTRUMENTS ]
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RM46L450  
RM46L850  
www.ti.com  
SPNS184 SEPTEMBER 2012  
1
RM46Lx50 16/32-Bit RISC Flash Microcontroller . 1  
4.11 Tightly-Coupled RAM Interface Module ............ 84  
4.12 Parity Protection for Accesses to peripheral RAMs 84  
4.13 On-Chip SRAM Initialization and Testing ........... 86  
4.14 External Memory Interface (EMIF) ................. 88  
4.15 Vectored Interrupt Manager ........................ 95  
4.16 DMA Controller ..................................... 99  
4.17 Real Time Interrupt Module ....................... 102  
4.18 Error Signaling Module ............................ 104  
4.19 Reset / Abort / Error Sources ..................... 108  
4.20 Digital Windowed Watchdog ...................... 111  
4.21 Debug Subsystem ................................. 112  
1.1 Features ............................................. 1  
1.2 Applications .......................................... 2  
1.3 Description ........................................... 3  
1.4 Functional Block Diagram ........................... 5  
Device Package and Terminal Functions .......... 8  
2.1 PGE QFP Package Pinout (144-Pin) ................ 8  
2
3
2.2  
ZWT BGA Package Ball-Map (337 Ball Grid Array) . 9  
2.3 Terminal Functions ................................. 10  
Device Operating Conditions ....................... 46  
3.1  
Absolute Maximum Ratings Over Operating Free-  
Air Temperature Range, ............................ 46  
5
Peripheral Information and Electrical  
3.2  
3.3  
Device Recommended Operating Conditions ...... 46  
Specifications ......................................... 117  
Switching Characteristics over Recommended  
5.1  
Enhanced Translator PWM Modules (ePWM) .... 117  
Operating Conditions for Clock Domains .......... 47  
5.2 Enhanced Capture Modules (eCAP) .............. 122  
5.3  
3.4 Wait States Required ............................... 47  
Enhanced Quadrature Encoder (eQEP) .......... 124  
Multi-Buffered 12bit Analog-to-Digital Converter .. 126  
3.5  
Power Consumption Over Recommended  
5.4  
Operating Conditions ............................... 48  
Input/Output Electrical Characteristics Over  
5.5 General-Purpose Input/Output .................... 137  
5.6 Enhanced High-End Timer (N2HET) .............. 138  
5.7 Controller Area Network (DCAN) .................. 142  
3.6  
Recommended Operating Conditions .............. 49  
3.7 Output Buffer Drive Strengths ...................... 50  
3.8 Input Timings ....................................... 51  
3.9 Output Timings ..................................... 51  
3.10 Low-EMI Output Buffers ............................ 53  
5.8  
Local Interconnect Network Interface (LIN) ....... 143  
Serial Communication Interface (SCI) ............ 144  
5.9  
5.10 Inter-Integrated Circuit (I2C) ...................... 145  
5.11 Multi-Buffered / Standard Serial Peripheral Interface  
..................................................... 148  
4
System Information and Electrical Specifications  
............................................................. 54  
5.12 Ethernet Media Access Controller ................ 160  
5.13 Universal Serial Bus Controller ................... 164  
Device and Documentation Support ............. 165  
4.1 Device Power Domains ............................ 54  
4.2 Voltage Monitor Characteristics .................... 54  
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7
4.3  
Power Sequencing and Power On Reset .......... 56  
6.1  
Device and Development-Support Tool  
4.4 Warm Reset (nRST) ................................ 58  
4.5 ARM© Cortex-R4F™ CPU Information ............. 59  
4.6 Clocks .............................................. 62  
4.7 Clock Monitoring .................................... 71  
4.8 Glitch Filters ........................................ 73  
4.9 Device Memory Map ................................ 74  
4.10 Flash Memory ...................................... 81  
Nomenclature ..................................... 165  
6.2 Community Resources ............................ 165  
6.3 Device Identification ............................... 166  
Mechanical Data ...................................... 167  
7.1 Thermal Data ...................................... 167  
7.2 Packaging Information ............................ 167  
Copyright © 2012, Texas Instruments Incorporated  
Contents  
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