SPNS184 – SEPTEMBER 2012
1
2
3
.
1.1
Features
.............................................
1.2
Applications
..........................................
1.3
Description
...........................................
1.4
Functional Block Diagram
...........................
5
Device Package and Terminal Functions
..........
2.1
PGE QFP Package Pinout (144-Pin)
................
8
2.2
ZWT BGA Package Ball-Map (337 Ball Grid Array)
.
2.3
Terminal Functions
.................................
Device Operating Conditions
.......................
RM46Lx50 16/32-Bit RISC Flash Microcontroller
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
3.10
Absolute Maximum Ratings Over Operating Free-
Air Temperature Range,
............................
Device Recommended Operating Conditions
......
Switching Characteristics over Recommended
Operating Conditions for Clock Domains
..........
Wait States Required
...............................
Power Consumption Over Recommended
Operating Conditions
...............................
Input/Output Electrical Characteristics Over
Recommended Operating Conditions
..............
4.11
4.12
4.13
4.14
4.15
4.16
4.17
4.18
4.19
4.20
4.21
Tightly-Coupled RAM Interface Module
............
Parity Protection for Accesses to peripheral RAMs
External Memory Interface (EMIF)
On-Chip SRAM Initialization and Testing
...........
.................
Vectored Interrupt Manager
........................
DMA Controller
.....................................
Real Time Interrupt Module
.......................
Error Signaling Module
............................
Reset / Abort / Error Sources
.....................
Digital Windowed Watchdog
......................
Debug Subsystem
.................................
....
Enhanced Capture Modules (eCAP)
..............
Enhanced Quadrature Encoder (eQEP)
..........
Multi-Buffered 12bit Analog-to-Digital Converter
..
General-Purpose Input/Output
....................
Enhanced High-End Timer (N2HET)
..............
Controller Area Network (DCAN)
..................
Local Interconnect Network Interface (LIN)
.......
Serial Communication Interface (SCI)
............
Inter-Integrated Circuit (I2C)
......................
Enhanced Translator PWM Modules (ePWM)
Ethernet Media Access Controller
5
Peripheral Information and Electrical
Specifications
.........................................
5.1
5.2
5.3
5.4
5.5
5.6
5.7
5.8
5.9
5.10
5.11
5.12
4
System Information and Electrical Specifications
.............................................................
4.1
Device Power Domains
............................
4.2
Voltage Monitor Characteristics
....................
4.3
Power Sequencing and Power On Reset
..........
4.4
Warm Reset (nRST)
................................
4.5
ARM
©
Cortex-R4F™ CPU Information
.............
4.6
Clocks
..............................................
4.7
Clock Monitoring
....................................
4.8
Glitch Filters
........................................
4.9
Device Memory Map
................................
4.10 Flash Memory
......................................
Multi-Buffered / Standard Serial Peripheral Interface
.....................................................
6
................
5.13 Universal Serial Bus Controller
...................
Device and Documentation Support
.............
6.1
6.2
Device and Development-Support Tool
Nomenclature
.....................................
Community Resources
7
............................
6.3
Device Identification
...............................
Mechanical Data
......................................
7.1
Thermal Data
......................................
7.2
Packaging Information
............................
Copyright © 2012, Texas Instruments Incorporated
Contents
Product Folder Links:
7
PRODUCT PREVIEW
......................
Input Timings
.......................................
Output Timings
.....................................
Low-EMI Output Buffers
............................
Output Buffer Drive Strengths
TI [ TEXAS INSTRUMENTS ]
