RM46L450
RM46L850
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SPNS184 –SEPTEMBER 2012
7 Mechanical Data
7.1 Thermal Data
Table 7-1 shows the thermal resistance characteristics for the QFP - PGE mechanical package.
Table 7-2 shows the thermal resistance characteristics for the BGA - ZWT mechanical package.
Table 7-1. Thermal Resistance Characteristics
(PGE Package)
PARAMETER
RΘJA
°C / W
45
5
RΘJC
Table 7-2. Thermal Resistance Characteristics
(ZWT Package)
PARAMETER
RΘJA
°C / W
18.8
7.1
RΘJC
7.2 Packaging Information
The following packaging information reflects the most current released data available for the designated
device(s). This data is subject to change without notice and without revision of this document.
Copyright © 2012, Texas Instruments Incorporated
Mechanical Data
167
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