DICE INFORMATION
PAD
FUNCTION
1
2
A0
A1
Ground
VIN
NC
6
NC
NC
NC
NC
3A, 3B, 3C(1)
4A, 4B, 4C(2)
6
7
8
V–
VO
V+
7
4C
NC: No Connection
NOTES: (1) Connect all three indicated pads. (2) Connect
all three indicated pads.
Substrate Bias: Internally connected to V– power supply.
8
1
2
MECHANICAL INFORMATION
3A
3B
3C
4A
4B
MILS (0.001")
MILLIMETERS
Die Size
Die Thickness
Min. Pad Size
69 x 105 ±5
20 ±3
1.75 x 2.67 ±0.13
0.51 ±0.08
4 x 4
0.1 x 0.1
PGA103 DIE TOPOGRAPHY
Backing
Gold
TYPICAL PERFORMANCE CURVES
TA = +25°C, VS = ±15V unless otherwise noted.
VOLTAGE GAIN vs FREQUENCY
50
POWER SUPPLY REJECTION vs FREQUENCY
120
100
80
60
40
20
0
G=100
40
30
G=100
G=10
G=10
20
10
G=1
G=1
0
–10
10k
100k
Frequency (Hz)
1M
10M
10
100
1k
10k
100k
1M
Frequency (Hz)
®
4
PGA103