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PGA103 参数 Datasheet PDF下载

PGA103图片预览
型号: PGA103
PDF下载: 下载PDF文件 查看货源
内容描述: [可编程增益放大器]
分类和应用: 放大器
文件页数/大小: 10 页 / 222 K
品牌: TI [ TEXAS INSTRUMENTS ]
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SPECIFICATIONS (CONT)  
ELECTRICAL  
TA = +25°C, VS = ±15V, RL = 2kunless otherwise specified.  
PGA103P, U  
TYP  
PARAMETER  
CONDITIONS  
MIN  
MAX  
UNITS  
POWER SUPPLY  
Voltage Range  
Current  
±4.5  
±15  
±2.6  
±18  
±3.5  
V
mA  
VIN = 0V  
TEMPERATURE RANGE  
Specification  
Operating  
–40  
–40  
+85  
+125  
°C  
°C  
θJA: P or U Package  
100  
°C/W  
PIN CONFIGURATION  
ABSOLUTE MAXIMUM RATINGS  
Supply Voltage ................................................................................. ±18V  
Analog Input Voltage Range ..................................................... V– to V+  
Logic Input Voltage Range ........................................................ V– to V+  
Output Short Circuit (to ground) ............................................ Continuous  
Operating Temperature ................................................ –40°C to +125°C  
Storage Temperature .................................................... –40°C to +125°C  
Junction Temperature ...................................................................+150°C  
Lead Temperature (soldering,10s) .............................................. +300°C  
Top View  
DIP/SO-8  
A0  
1
8
V+  
A1  
Ground  
VIN  
2
3
4
7
6
5
VO  
V–  
NC  
PACKAGE INFORMATION  
PACKAGE DRAWING  
MODEL  
PACKAGE  
NUMBER(1)  
ORDERING INFORMATION  
PGA103P  
PGA103U  
8-Pin Plastic DIP  
SO-8 Surface-Mount  
006  
182  
MODEL  
PACKAGE  
TEMPERATURE RANGE  
NOTE: (1) For detailed drawing and dimension table, please see end of data  
sheet, or Appendix D of Burr-Brown IC Data Book.  
PGA103P  
PGA103U  
8-Pin Plastic DIP  
SO-8 Surface-Mount  
–40°C to +85°C  
–40°C to +85°C  
ELECTROSTATIC  
DISCHARGE SENSITIVITY  
Any integrated circuit can be damaged by ESD. Burr-Brown  
recommends that all integrated circuits be handled with ap-  
propriate precautions. Failure to observe proper handling and  
installation procedures can cause damage.  
ESD damage can range from subtle performance degradation  
to complete device failure. Precision integrated circuits may  
be more susceptible to damage because very small parametric  
changes could cause the device not to meet published speci-  
fications.  
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes  
no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change  
without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant  
any BURR-BROWN product for use in life support devices and/or systems.  
®
3
PGA103  
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