OPA861
www.ti.com
SBOS338–AUGUST 2005
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated
circuits be handled with appropriate precautions. Failure to observe proper handling and installation
procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision
integrated circuits may be more susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
SPECIFIED
PACKAGE
DESIGNATOR
TEMPERATURE
RANGE
PACKAGE
MARKING
ORDERING
NUMBER
TRANSPORT MEDIA,
QUANTITY
PRODUCT
PACKAGE
OPA861ID
OPA861IDR
Rails, 75
OPA861
SO-8
D
–45°C to +85°C
–45°C to +85°C
OPA861
N5R
Tape and Reel, 2500
Tape and Reel, 250
Tape and Reel, 3000
OPA861IDBVT
OPA861IDBVR
OPA861
SOT23-6
DBV
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS(1)
Power Supply
±6.5VDC
See Thermal Information
±1.2V
Internal Power Dissipation
Differential Input Voltage
Input Common-Mode Voltage Range
Storage Temperature Range: D
Lead Temperature (soldering, 10s)
Junction Temperature (TJ)
ESD Rating:
±VS
–40°C to +125°C
+260°C
+150°C
Human Body Model (HBM)(2)
1500V
1000V
Charge Device Model (CDM)
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operations of the device at these and any other conditions
beyond those specified is not supported.
(2) Pin 2 for the SO-8 package > 500V HBM. Pin 4 for the SOT23-6 package > 500V HBM.
PIN CONFIGURATION
Top View
1
2
3
4
8
7
6
5
IQ Adjust
C
1
2
3
6
5
4
IQ Adjust
+VS
C
E
B
V+ = +5V
NC
−
VS
B
−
V
−
5V
=
NC
E
SOT23−6
SO−8
2
TI [ TEXAS INSTRUMENTS ]
