PACKAGE OPTION ADDENDUM
www.ti.com
18-Feb-2005
PACKAGING INFORMATION
Orderable Device
NE5532AD
Status (1)
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
D
8
75
Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR
NE5532ADR
SOIC
D
8
2500
Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR
NE5532AIP
NE5532AP
OBSOLETE
ACTIVE
PDIP
PDIP
P
P
8
8
None
Call TI
Call TI
50
2000
75
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
NE5532APSR
NE5532D
ACTIVE
ACTIVE
ACTIVE
SO
PS
D
8
8
8
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
SOIC
SOIC
Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR
NE5532DR
D
2500
Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR
NE5532IP
NE5532P
OBSOLETE
ACTIVE
PDIP
PDIP
P
P
8
8
None
Call TI
Call TI
50
2000
75
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
NE5532PSR
SA5532AD
SA5532ADR
SA5532AP
SA5532D
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SO
PS
D
D
P
8
8
8
8
8
8
8
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
SOIC
SOIC
PDIP
SOIC
SOIC
PDIP
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
2500
50
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
D
D
P
75
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
SA5532DR
SA5532P
2500
50
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
Addendum-Page 1
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