MSP430G2955
MSP430G2855
MSP430G2755
SLAS800 –MARCH 2013
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RAM
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
MAX UNIT
(1)
V(RAMh)
RAM retention supply voltage
CPU halted
1.6
V
(1) This parameter defines the minimum supply voltage VCC when the data in RAM remains unchanged. No program execution should
happen during this supply voltage condition.
JTAG and Spy-Bi-Wire Interface
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
Spy-Bi-Wire input frequency
VCC
MIN
0
TYP
MAX UNIT
fSBW
2.2 V
2.2 V
2.2 V
2.2 V
2.2 V
2.2 V
20 MHz
tSBW,Low
tSBW,En
tSBW,Ret
fTCK
Spy-Bi-Wire low clock pulse duration
0.025
15
1
µs
µs
Spy-Bi-Wire enable time (TEST high to acceptance of first clock edge(1)
Spy-Bi-Wire return to normal operation time
TCK input frequency(2)
)
15
0
100
5
µs
MHz
kΩ
RInternal
Internal pulldown resistance on TEST
25
60
90
(1) Tools accessing the Spy-Bi-Wire interface need to wait for the maximum tSBW,En time after pulling the TEST/SBWTCK pin high before
applying the first SBWTCK clock edge.
(2) fTCK may be restricted to meet the timing requirements of the module selected.
JTAG Fuse(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
Supply voltage during fuse-blow condition
Voltage level on TEST for fuse blow
Supply current into TEST during fuse blow
Time to blow fuse
TEST CONDITIONS
TA = 25°C
MIN
2.5
6
MAX UNIT
VCC(FB)
VFB
V
7
100
1
V
IFB
mA
ms
tFB
(1) Once the fuse is blown, no further access to the JTAG/Test, Spy-Bi-Wire, and emulation feature is possible, and JTAG is switched to
bypass mode.
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