PACKAGE OUTLINE
NGN0008A
WSON - 0.8 mm max height
SCALE 3.000
PLASTIC SMALL OUTLINE - NO LEAD
4.1
3.9
B
A
PIN 1 INDEX AREA
4.1
3.9
PIN 1 ID
DETAIL A
PIN 1 ID
C
0.8 MAX
SEATING PLANE
0.08 C
0.05
0.00
2.2 0.05
SYMM
EXPOSED
THERMAL PAD
(0.2) TYP
6X 0.8
4
5
2X
2.4
SYMM
9
3
0.05
SEE
DETAIL A
8
1
0.35
0.25
8X
(0.25)
(0.25)
0.6
0.4
(0.2)
8X
0.1
C A B
C
0.05
PIN 1 ID
(0.15)
4214794/A 11/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
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