EXAMPLE BOARD LAYOUT
NGN0008A
WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
(2.2)
SYMM
8X (0.5)
8X (0.3)
1
8
SYMM
9
(3)
(1.25)
5
6X (0.8)
4
(R0.05) TYP
(
0.2) VIA
TYP
(0.85)
(3.3)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
EXPOSED
METAL
EXPOSED
METAL
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
NON SOLDER MASK
SOLDER MASK
DEFINED
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4214794/A 11/2019
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
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