PACKAGE MATERIALS INFORMATION
www.ti.com
23-Jun-2023
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LP2988IMM-3.0/NOPB VSSOP
LP2988IMM-3.3/NOPB VSSOP
DGK
DGK
DGK
DGK
DGK
D
8
8
8
8
8
8
1000
1000
1000
1000
3500
2500
178.0
178.0
178.0
178.0
330.0
330.0
12.4
12.4
12.4
12.4
12.4
12.4
5.3
5.3
5.3
5.3
5.3
6.5
3.4
3.4
3.4
3.4
3.4
5.4
1.4
1.4
1.4
1.4
1.4
2.0
8.0
8.0
8.0
8.0
8.0
8.0
12.0
12.0
12.0
12.0
12.0
12.0
Q1
Q1
Q1
Q1
Q1
Q1
LP2988IMM-5.0
VSSOP
LP2988IMM-5.0/NOPB VSSOP
LP2988IMMX-3.3/NOPB VSSOP
LP2988IMX-5.0/NOPB
SOIC
Pack Materials-Page 2
TI [ TEXAS INSTRUMENTS ]
