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LM5050-1 参数 Datasheet PDF下载

LM5050-1图片预览
型号: LM5050-1
PDF下载: 下载PDF文件 查看货源
内容描述: 高端的OR-ing FET控制器 [High Side OR-ing FET Controller]
分类和应用: 控制器
文件页数/大小: 17 页 / 331 K
品牌: TI [ TEXAS INSTRUMENTS ]
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OFF PIN  
The OFF pin is a logic level input pin that is used to control  
the gate drive to the external MOSFET. The maximum oper-  
ating voltage on this pin is 5.5V.  
When the OFF pin is high, the MOSFET is turned off (inde-  
pendent of the sensed IN and OUT voltages). In this mode,  
load current will flow through the body diode of the MOSFET.  
The voltage difference between the IN pin and OUT pins will  
be approximately 700 mV if the MOSFET is operating nor-  
mally through the body diode.  
30104824  
The OFF pin has an internal pull-down of 5 µA (typical). If the  
OFF function is not required the pin may be left open or con-  
nected to ground.  
FIGURE 8.  
MOSFET Selection  
The important MOSFET electrical parameters are the maxi-  
mum continuous Drain current ID, the maximum Source cur-  
rent (i.e. body diode) IS, the maximum drain-to-source voltage  
VDS(MAX), the gate-to-source threshold voltage VGS(TH), the  
drain-to-source reverse breakdown voltage V(BR)DSS, and the  
drain-to-source On resistance RDS(ON)  
.
The maximum continuous drain current, ID, rating must ex-  
ceed the maximum continuous load current. The rating for the  
maximum current through the body diode, IS, is typically rated  
the same as, or slightly higher than the drain current, but body  
diode current only flows while the MOSFET gate is being  
charged to VGS(TH)  
.
Gate Charge Time = Qg / IGATE(ON)  
The maximum drain-to-source voltage, VDS(MAX), must be  
high enough to withstand the highest differential voltage seen  
in the application. This would include any anticipated fault  
conditions.  
30104823  
FIGURE 7.  
The drain-to-source reverse breakdown voltage, V(BR)DSS  
,
may provide some transient protection to the OUT pin in low  
voltage applications by allowing conduction back to the IN pin  
during positive transients at the OUT pin.  
SHORT CIRCUIT FAILURE OF AN INPUT SUPPLY  
An abrupt zero ohm short circuit across the input supply will  
cause the highest possible reverse current to flow while the  
internal LM5050-1 control circuitry discharges the gate of the  
MOSFET. During this time, the reverse current is limited only  
by the RDS(ON) of the MOSFET, along with parasitic wiring re-  
sistances and inductances. Worst case instantaneous re-  
verse current would be limited to:  
The gate-to-source threshold voltage, VGS(TH), should be  
compatible with the LM5050-1 gate drive capabilities. Logic  
level MOSFETs, with RDS(ON) rated at VGS(TH) at 5V, are rec-  
ommended, but sub-Logic level MOSFETs having RDS(ON)  
rated at VGS(TH) at 2.5V, can also be used. Standard level  
MOSFETs, with RDS(ON) rated at VGS(TH) at 10V, are not rec-  
ommended.  
ID(REV) = (VOUT - VIN) / RDS(ON)  
The dominate MOSFET loss for the LM5050-1 active OR-ing  
controller is conduction loss due to source-to-drain current to  
the output load, and the RDS(ON) of the MOSFET. This con-  
duction loss could be reduced by using a MOSFET with the  
lowest possible RDS(ON). However, contrary to popular belief,  
arbitrarily selecting a MOSFET based solely on having low  
RDS(ON) may not always give desirable results for several rea-  
sons:  
The internal Reverse Comparator will react, and will start the  
process of discharging the Gate, when the reverse current  
reaches:  
ID(REV) = VSD(REV) / RDS(ON)  
When the MOSFET is finally switched off, the energy stored  
in the parasitic wiring inductances will be transferred to the  
rest of the circuit. As a result, the LM5050-1 IN pin will see a  
negative voltage spike while the OUT pin will see a positive  
voltage spike. The IN pin can be protected by diode clamping  
the pin to GND in the negative direction. The OUT pin can be  
protected with a TVS protection diode, a local bypass capac-  
itor, or both. In low voltage applications, the MOSFET drainto-  
source breakdown voltage rating may be adequate to protect  
the OUT pin (i.e. VIN + V(BR)DSS(MAX) < 75V ), but most MOS-  
FET datasheets do not guarantee the maximum breakdown  
rating, so this method should be used with caution.  
1) Reverse transition detection. Higher RDS(ON) will provide  
increased voltage information to the LM5050-1 Reverse  
Comparator at a lower reverse current level. This will give an  
earlier MOSFET turn-off condition should the input voltage  
become shorted to ground. This will minimize any disturbance  
of the redundant bus.  
2) Reverse current leakage. In cases where multiple input  
supplies are closely matched it may be possible for some  
small current to flow continuously through the MOSFET drain  
to source (i.e. reverse) without activating the LM5050-1 Re-  
verse Comparator. Higher RDS(ON) will reduce this reverse  
current level.  
3) Cost. Generally, as the RDS(ON) rating goes lower, the cost  
of the MOSFET goes higher.  
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