LM3886
SNAS091C –MAY 1999–REVISED MARCH 2013
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Typical Application
*Optional components dependent upon specific design requirements. Refer to External Components Description for a
component functional description.
Figure 1. Typical Audio Amplifier Application Circuit
Connection Diagram
Top View
Preliminary: call your local Texas Instruments Sales Rep. or distributor for availability
Figure 2. TO-220 and PFM Plastic Packages
See Package Number NDJ0011B for Staggered Lead Non-Isolated Package or NDA0011B for Staggered
Lead Isolated Package(1)
(1) The LM3886T package TA11B is a non-isolated package, setting the tab of the device and the heat sink at V− potential when the
LM3886 is directly mounted to the heat sink using only thermal compound. If a mica washer is used in addition to thermal compound,
θCS (case to sink) is increased, but the heat sink will be isolated from V−.
2
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