SNAS091C – MAY 1999 – REVISED MARCH 2013
Typical Application
*Optional components dependent upon specific design requirements. Refer to
for a
component functional description.
Figure 1. Typical Audio Amplifier Application Circuit
Connection Diagram
Top View
Preliminary: call your local Texas Instruments Sales Rep. or distributor for availability
Figure 2. TO-220 and PFM Plastic Packages
See Package Number NDJ0011B for Staggered Lead Non-Isolated Package or NDA0011B for Staggered
Lead Isolated Package
(1)
(1)
The LM3886T package TA11B is a non-isolated package, setting the tab of the device and the heat sink at V
−
potential when the
LM3886 is directly mounted to the heat sink using only thermal compound. If a mica washer is used in addition to thermal compound,
θ
CS
(case to sink) is increased, but the heat sink will be isolated from V
−
.
2
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