LM124, LM124A, LM224, LM224A
LM324, LM324A, LM324Y, LM2902, LM2902Q
QUADRUPLE OPERATIONAL AMPLIFIERS
SLOS066E– SEPTEMBER 1975 – REVISED FEBRUARY1997
LM324Y chip information
This chip, when properly assembled, displays characteristics similar to the LM324. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(1)
(2)
(14)
(13)
1IN+
1IN–
VCC+
(4)
(3)
(2)
(1)
(5)
1OUT
2IN+
(6)
2IN–
(8)
3OUT
(12)
4IN+
(13)
4IN–
(3)
(12)
(7)
2OUT
(10)
3IN+
(9)
3IN–
(14)
4OUT
(11)
GND
62
(4)
(5)
(11)
(10)
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4
×
4 MINIMUM
(6)
(7)
(8)
(9)
TJmax = 150°C
TOLERANCES ARE
±
10%.
ALL DIMENSIONS ARE IN MILS.
65
PIN (11) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265
3–3
TI [ TEXAS INSTRUMENTS ]
