LM2672
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SNVS136K –SEPTEMBER 1998–REVISED APRIL 2013
If open core inductors are used, special care must be taken as to the location and positioning of this type of
inductor. Allowing the inductor flux to intersect sensitive feedback, IC ground path, and COUT wiring can cause
problems.
When using the adjustable version, special care must be taken as to the location of the feedback resistors and
the associated wiring. Physically locate both resistors near the IC, and route the wiring away from the inductor,
especially an open core type of inductor.
WSON PACKAGE DEVICES
The LM2672 is offered in the 16 lead WSON surface mount package to allow for increased power dissipation
compared to the SOIC-8 and PDIP.
The Die Attach Pad (DAP) can and should be connected to PCB Ground plane/island. For CAD and assembly
guidelines
refer
to
Application
Note
AN-1187
at
http://www.ti.com/lsds/ti/analog/powermanagement/power_portal.page.
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