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SLOS580B – MAY 2008 – REVISED JULY 2008
DEVICE INFORMATION
Table 1. Driver Function Table
V
CC1
V
CC2
INPUT
(D)
ENABLE
INPUT
(DE)
A or Y
PU
PU
PU
PU
PU
PD
PU
PD
PU
PU
PU
PU
PU
PU
PD
PD
H
L
X
X
OPEN
X
X
X
H
H
L
OPEN
H
X
X
X
H
L
Z
Z
H
Z
Z
Z
OUTPUTS
B or Z
L
H
Z
Z
L
Z
Z
Z
Table 2. Receiver Function Table
V
CC1
PU
PU
PU
PU
PU
PU
PU
PU
PD
PU
V
CC2
PU
PU
PU
PU
PU
PU
PU
PU
PU
PD
DIFFERENTIAL INPUT
V
ID
= (V
A
– V
B
)
–0.01 V
≤
V
ID
–0.2 V < V
ID
< –0.01 V
V
ID
≤
–0.2 V
X
X
Open circuit
Short Circuit
Idle (terminated) bus
X
X
ENABLE
(RE)
L
L
L
H
OPEN
L
L
L
X
L
OUTPUT
(R)
H
?
L
Z
Z
H
H
H
Z
H
PACKAGE CHARACTERISTICS
over recommended operating conditions (unless otherwise noted)
PARAMETER
(1)
L(I01)
L(I02)
CTI
Minimum air gap (Clearance)
Minimum external tracking (Creepage)
Tracking resistance (Comparative Tracking
Index)
Minimum Internal Gap (Internal Clearance)
R
IO
C
IO
C
I
(1)
Isolation resistance
Barrier capacitance Input to output
Input capacitance to ground
TEST CONDITIONS
Shortest terminal to terminal distance through air
Shortest terminal to terminal distance across the
package surface
DIN IEC 60112 / VDE 0303 Part 1
Distance through the insulation
Input to output, V
IO
= 500 V, all pins on each
side of the barrier tied together creating a
two-terminal device
V
I
= 0.4 sin (4E6πt)
V
I
= 0.4 sin (4E6πt)
MIN
8.34
8.1
≥175
0.008
>10
12
2
2
TYP
MAX
UNIT
mm
mm
V
mm
Ω
pF
pF
Creepage and clearance requirements should be applied according to the specific equipment isolation standards of an application. Care
should be taken to maintain the creepage and clearance distance of a board design to ensure that the mounting pads of the isolator on
the printed circuit board do not reduce this distance.
Creepage and clearance on a printed circuit board become equal according to the measurement techniques shown in the Isolation
Glossary. Techniques such as inserting grooves and/or ribs on a printed circuit board are used to help increase these specifications.
Copyright © 2008, Texas Instruments Incorporated
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