EXAMPLE STENCIL DESIGN
PWP0016J
PowerPADTM TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
(2.46)
BASED ON
0.125 THICK
STENCIL
16X (1.5)
METAL COVERED
BY SOLDER MASK
16X (0.45)
1
16
(R0.05) TYP
SYMM
(3.55)
BASED ON
0.125 THICK
STENCIL
14X (0.65)
9
8
SYMM
(5.8)
SEE TABLE FOR
DIFFERENT OPENINGS
FOR OTHER STENCIL
THICKNESSES
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 10X
STENCIL
THICKNESS
SOLDER STENCIL
OPENING
0.1
2.75 X 3.97
2.46 X 3.55 (SHOWN)
2.25 X 3.24
0.125
0.15
0.175
2.08 X 3.00
4223595/A 03/2017
NOTES: (continued)
10. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
11. Board assembly site may have different recommendations for stencil design.
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TI [ TEXAS INSTRUMENTS ]
