PACKAGE OUTLINE
PWP0016J
PowerPADTM TSSOP - 1.2 mm max height
S
C
A
L
E
2
.
5
0
0
SMALL OUTLINE PACKAGE
C
SEATING
PLANE
6.6
6.2
TYP
0.1 C
A
PIN 1 INDEX
AREA
14X 0.65
16
1
2X
5.1
4.9
4.55
NOTE 3
8
9
0.30
16X
4.5
4.3
B
0.19
0.1
C A B
(0.15) TYP
SEE DETAIL A
9
8
0.25
1.2 MAX
GAGE PLANE
3.55
2.68
0.15
0.05
0.75
0.50
0 -8
A
20
16
1
DETAIL A
TYPICAL
2.46
1.75
THERMAL
PAD
4223595/A 03/2017
PowerPAD is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. Reference JEDEC registration MO-153.
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