DRV8874
SLVSF66A –AUGUST 2019–REVISED DECEMBER 2019
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11 Device and Documentation Support
11.1 Documentation Support
11.1.1 Related Documentation
For related documentation, see the following:
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Texas Instruments, Calculating Motor Driver Power Dissipation application report
Texas Instruments, Current Recirculation and Decay Modes application report
Texas Instruments, PowerPAD™ Made Easy application report
Texas Instruments, PowerPAD™ Thermally Enhanced Package application report
Texas Instruments, Understanding Motor Driver Current Ratings application report
Texas Instruments, Best Practices for Board Layout of Motor Drivers application report
Texas Instruments, Motor Drives Layout Guide application report
Texas Instruments, DRV8874 Evaluation Module (EVM) tool folder
11.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
11.3 Community Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
11.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
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