DRV8860
SLRS065A –SEPTEMBER 2013–REVISED NOVEMBER 2013
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Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
(2) (3)
DRV8860
UNIT
MIN
–0.3
0
MAX
Power supply voltage range (VM)
40
20
7
V
mA
V
Digital input pin current range (ENABLE, LATCH, CLK, DIN)
Digital output pin voltage range (DOUT, nFAULT)
Digital output pin current (DOUT, nFAULT)
Output voltage range (OUTx)
–0.5
–0.5
–0.3
7
V
40
V
Output current range (OUTx)
Internally limited
A
Operating virtual junction temperature range, TJ
Storage temperature range, Tstg
–40
–60
150
150
°C
°C
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
(3) Power dissipation and thermal limits must be observed
Thermal Information(1)
over operating free-air temperature range (unless otherwise noted)
DRV8860
THERMAL METRIC
UNITS
PW (16 PINS)
(2)
ΘJA
Junction-to-ambient thermal resistance
103
37.9
48
ΘJC(TOP)
ΘJB
Junction-to-case (top) thermal resistance(3)
Junction-to-board thermal resistance(4)
°C/W
ΨJT
Junction-to-top characterization parameter(5)
Junction-to-board characterization parameter(6)
3
ΨJB
47.4
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, High-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC standard
test exists, but a close description can be found in the ANSI SEMI standard 30-88.
(4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
(5) The junction-to-top characterization parameter, ΨJT, estimates the junction temperature of the device in a real system and is extracted
from the simulation data for obtaining ΘJA, using a procedure described in JESD51-2a (sections 6 and 7).
(6) The junction-to-board characterization parameter, ΨJB, estimates the junction temperature of the device in a real system and is
extracted from the simulation data for obtaining ΘJA, using a procedure described in JESD51-2a (sections 6 and 7).
Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX UNIT
VM
IOUT
TA
Motor power supply voltage range
Low-side driver current capability
Operating ambient temperature range
8.2
38
560
85
V
mA
°C
–40
4
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