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SLOS390A – NOVEMBER 2001– REVISED MAY 2002
MECHANICAL DATA
VFP (S-PQFP-G32)
PowerPAD PLASTIC QUAD FLATPACK
0,45
M
0,22
0,80
24
0,30
17
25
16
Thermal Pad
(See Note D)
32
9
0,13 NOM
1
8
5,60 TYP
7,20
SQ
6,80
Gage Plane
9,20
SQ
8,80
0,25
0,05 MIN
0°–7°
1,45
1,35
0,75
0,45
Seating Plane
0,10
1,60 MAX
4200791/A04/00
NOTES:A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
D. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane.
This pad is electrically and thermally connected to the backside of the die and possibly selected leads.
E. Falls within JEDEC MS-026
PowerPAD is a trademark of Texas Instruments.
12
TI [ TEXAS INSTRUMENTS ]
