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BQ24735 参数 Datasheet PDF下载

BQ24735图片预览
型号: BQ24735
PDF下载: 下载PDF文件 查看货源
内容描述: 1-4节锂电池SMBus充电控制器与N通道功率MOSFET选择支持睿频加速模式 [1-4 Cell Li Battery SMBus Charge Controller for Supporting Turbo Boost Mode with N-Channel Power MOSFET Selector]
分类和应用: 电池控制器
文件页数/大小: 42 页 / 1517 K
品牌: TI [ TEXAS INSTRUMENTS ]
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bq24735  
SLUSAK9 SEPTEMBER 2011  
www.ti.com  
Pin Functions 20-Pin QFN (continued)  
PIN  
DESCRIPTION  
NO. NAME  
6
ACDET  
Adapter detection input. Program adapter valid input threshold by connecting a resistor divider from adapter input to  
ACDET pin to GND pin. When ACDET pin is above 0.6V and VCC is above UVLO, REGN LDO is present, ACOK  
comparator and IOUT are both active.  
7
IOUT  
Buffered adapter or charge current output, selectable with SMBus command ChargeOption(). IOUT voltage is 20 times  
the differential voltage across sense resistor. Place a 100pF or less ceramic decoupling capacitor from IOUT pin to  
GND.  
8
9
SDA  
SCL  
ILIM  
SMBus open-drain data I/O. Connect to SMBus data line from the host controller or smart battery. Connect a 10kΩ  
pull-up resistor according to SMBus specifications.  
SMBus open-drain clock input. Connect to SMBus clock line from the host controller or smart battery. Connect a 10kΩ  
pull-up resistor according to SMBus specifications.  
10  
Charge current limit input. Program ILIM voltage by connecting a resistor divider from system reference 3.3V rail to ILIM  
pin to GND pin. The lower of ILIM voltage or DAC limit voltage sets charge current regulation limit. To disable the  
control on ILIM, set ILIM above 1.6V. Once voltage on ILIM pin falls below 75mV, charge (buck mode) or discharge  
(boost mode) is disabled. Charge and discharge is enabled when ILIM pin rises above 105mV.  
11  
12  
BATDRV Charge pump output to drive Battery to System n-channel MOSFET (BATFET). BATDRV voltage is 6V above SRN to  
turn on BATFET to power the system from battery. BATDRV voltage is SRN voltage to turn off BATFET to power  
system from AC adapter. Place a 4kΩ resistor from BATDRV to the gate of BATFET limits the in-rush current on  
BATDRV pin.  
SRN  
Charge current sense resistor negative input. SRN pin is for battery voltage sensing as well. Connect SRN pin to a 7.5  
Ω resistor first then from resistor another terminal connect a 0.1µF ceramic capacitor to GND for common-mode filtering  
and connect to current sensing resistor. Connect a 0.1µF ceramic capacitor between current sensing resistor to provide  
differential mode filtering. See application information about negative output voltage protection for hard shorts on battery  
to ground or battery reverse connection by adding small resistor.  
13  
14  
SRP  
GND  
Charge current sense resistor positive input. Connect SRP pin to a 10 Ω resistor first then from resistor another terminal  
connect to current sensing resistor. Connect a 0.1µF ceramic capacitor between current sensing resistor to provide  
differential mode filtering. See application information about negative output voltage protection for hard shorts on battery  
to ground or battery reverse connection by adding small resistor.  
IC ground. On PCB layout, connect to analog ground plane, and only connect to power ground plane through the power  
pad underneath IC.  
15  
16  
LODRV  
REGN  
Low side power MOSFET driver output. Connect to low side n-channel MOSFET gate.  
Linear regulator output. REGN is the output of the 6V linear regulator supplied from VCC. The LDO is active when  
voltage on ACDET pin is above 0.6V and voltage on VCC is above UVLO. Connect a 1µF ceramic capacitor from  
REGN to GND.  
17  
BTST  
High side power MOSFET driver power supply. Connect a 0.047µF capacitor from BTST to PHASE, and a bootstrap  
Schottky diode from REGN to BTST.  
18  
19  
20  
HIDRV  
PHASE  
VCC  
High side power MOSFET driver output. Connect to the high side n-channel MOSFET gate.  
High side power MOSFET driver source. Connect to the source of the high side n-channel MOSFET.  
Input supply, diode OR from adapter or battery voltage. Use 10Ω resistor and 1µF capacitor to ground as low pass filter  
to limit inrush current.  
PowerPAD  
Exposed pad beneath the IC. Analog ground and power ground star-connected only at the PowerPad plane. Always  
solder PowerPad to the board, and have vias on the PowerPad plane connecting to analog ground and power ground  
planes. It also serves as a thermal pad to dissipate the heat.  
14  
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