bq24170
bq24172
SLUSAD2A –NOVEMBER 2010–REVISED NOVEMBER 2010
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UNIT
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)(2)
VALUE
–0.3 to 20
–0.3 to 26
–0.3 to 20
–2 to 20
PVCC, AVCC, ACP, ACN, CMSRC, STAT
ACDRV, BTST
BATDRV, SRP, SRN
SW
Voltage range (with respect to AGND)
V
FB (bq24172)
–0.3 to 16
–0.3 to 7
OVPSET, REGN, TS, TTC, CELL (bq24170)
VREF, ISET, ACSET
PGND
–0.3 to 3.6
–0.3 to 0.3
–0.5 to 0.5
–40 to 155
–55 to 155
Maximum difference voltage
Junction temperature range, TJ
Storage temperature range, Tstg
SRP–SRN, ACP-ACN
V
°C
°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to GND if not specified. Currents are positive into, negative out of the specified terminal. Consult Packaging
Section of the data book for thermal limitations and considerations of packages.
THERMAL INFORMATION
bq24170/2
THERMAL METRIC(1)
RGY
24 PINS
35.7
UNITS
qJA
yJT
yJB
Junction-to-ambient thermal resistance(2)
Junction-to-top characterization parameter(3)
Junction-to-board characterization parameter(4)
0.4
°C/W
31.2
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(3) The junction-to-top characterization parameter, yJT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining qJA, using a procedure described in JESD51-2a (sections 6 and 7).
(4) The junction-to-board characterization parameter, yJB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining qJA , using a procedure described in JESD51-2a (sections 6 and 7).
RECOMMENDED OPERATING CONDITIONS
MIN
MAX UNIT
Input voltage
VIN
4.5
17
13.5
4
V
V
Output voltage
VOUT
Output current (RSR 10mΩ)
IOUT
600
–200
–200
–40
A
ACP - ACN
SRP–SRN
200
200
85
mV
mV
°C
Maximum difference voltage
Operation free-air temperature range, TA
8
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