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SLUS694B – MARCH 2006 – REVISED AUGUST 2006
ABSOLUTE MAXIMUM RATINGS
(1)
over operating free-air temperature range (unless otherwise noted)
bq24070/1
Input voltage
IN (DC voltage wrt (with respect to) VSS)
BAT, CE, DPPM, PG, Mode, OUT, ISET1, ISET2, STAT1,
STAT2, TS, (all DC voltages wrt VSS)
Input voltage
V
REF
(DC voltage wrt VSS)
TMR
Input current
Output current
Output sink current
Storage temperature range, T
stg
Junction temperature range, T
J
Lead temperature (soldering, 10 seconds)
(1)
OUT
BAT
(2)
PG, STAT1, STAT2,
–0.3 V to 18 V
–0.3 V to 7 V
–0.3 V to V
O(OUT)
+ 0.3 V
–0.3 V to V
O
+ 0.3 V
3.5 A
4A
–4 A to 3.5 A
1.5 mA
–65°C to 150°C
–40°C to 150°C
300°C
(2)
Stresses beyond those listed under
absolute maximum ratings
may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under
recommended operating
conditions
is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage
values are with respect to the network ground terminal unless otherwise noted.
Negative current is defined as current flowing into the BAT pin.
RECOMMENDED OPERATING CONDITIONS
MIN
V
CC
I
AC
T
J
(1)
Supply voltage (V
IN
)
Input current
Operating junction temperature range
Verify that power dissipation and junction temperatures are within limits at maximum V
CC
.
–40
(1)
MAX
16
2
125
UNIT
V
A
°C
4.35
DISSIPATION RATINGS
PACKAGE
20-pin RHL
(1)
(1)
T
A
≤
40°C
POWER RATING
1.81 W
DERATING FACTOR
T
A
> 40°C
21 mW/°C
θ
JA
46.87 °C/W
This data is based on using the JEDEC High-K board and the exposed die pad is connected to a Cu pad on the board. This is
connected to the ground plane by a 2×3 via matrix.
3
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