bq24070
bq24071
www.ti.com
SLUS694B–MARCH 2006–REVISED AUGUST 2006
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
bq24070/1
Input voltage
Input voltage
IN (DC voltage wrt (with respect to) VSS)
–0.3 V to 18 V
BAT, CE, DPPM, PG, Mode, OUT, ISET1, ISET2, STAT1,
STAT2, TS, (all DC voltages wrt VSS)
–0.3 V to 7 V
VREF (DC voltage wrt VSS)
TMR
–0.3 V to VO(OUT) + 0.3 V
–0.3 V to VO + 0.3 V
3.5 A
Input current
OUT
BAT(2)
4 A
Output current
–4 A to 3.5 A
1.5 mA
Output sink current
PG, STAT1, STAT2,
Storage temperature range, Tstg
Junction temperature range, TJ
–65°C to 150°C
–40°C to 150°C
300°C
Lead temperature (soldering, 10 seconds)
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage
values are with respect to the network ground terminal unless otherwise noted.
(2) Negative current is defined as current flowing into the BAT pin.
RECOMMENDED OPERATING CONDITIONS
MIN
MAX UNIT
(1)
VCC Supply voltage (VIN
)
4.35
16
2
V
A
IAC
TJ
Input current
Operating junction temperature range
–40
125
°C
(1) Verify that power dissipation and junction temperatures are within limits at maximum VCC
.
DISSIPATION RATINGS
T
A ≤ 40°C
DERATING FACTOR
PACKAGE
θJA
46.87 °C/W
POWER RATING
TA > 40°C
20-pin RHL(1)
1.81 W
21 mW/°C
(1) This data is based on using the JEDEC High-K board and the exposed die pad is connected to a Cu pad on the board. This is
connected to the ground plane by a 2×3 via matrix.
3
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